AMD confirms MI450 AI accelerator uses cutting-edge 2nm silicon

In a discussion with Yahoo Finance, reported by Daniel Romero, AMD CEO Lisa Su has announced that the upcoming MI450 AI accelerator will be built on 2nm silicon. This advanced AI accelerator is expected to launch in 2026, with OpenAI planning a large-scale deployment of 1GW using these GPUs.

Why is the choice of 2nm significant? The answer is straightforward: utilizing superior silicon leads to improved products. Nvidia’s forthcoming Vera-Rubin series AI accelerators will be based on 3nm silicon, providing AMD with a competitive edge. This advantage could empower AMD to better challenge Nvidia's next-generation AI offerings.

With the MI450, AMD aims to outperform Nvidia. The MI450 seeks to deliver higher memory bandwidth and capacity compared to Nvidia, potentially capturing a larger share of the market. AMD intends to disrupt the assumption that Nvidia is the go-to option for AI computing. With the MI450, AMD is striving to enhance its hardware advantage, including their use of 2nm silicon and robust memory specifications.

Similar to earlier AMD Instinct architectures, the MI450 will adopt a chiplet-based design. Consequently, not all components of AMD’s MI450 silicon will be 2nm. According to the leaker Kepler_L2, the MI450 GPU will also feature TSMC N3P (3nm) silicon for its Active Interposer Die (AID) and Media Interface Die (MID); only the Accelerator Core Die (XCD) will employ TSMC’s 2nm (N2) process.

Beyond AI, AMD’s next-generation CPU series may be forthcoming, but if you’re in the market for top-tier gaming performance right now, the Ryzen 7 9800X3D stands out as the leading processor. Featuring advanced 3D V-Cache technology, significant gaming performance enhancement, and established efficiency, it represents the ultimate choice for gamers seeking smooth frame rates and exceptional responsiveness today. As always, for the latest news on hardware launches and industry developments, be sure to follow our dedicated hardware coverage.